2014 has been off to a strong start for Hong Kong, with Bindo and Craftyful taking the top prize at Singapore’s ‘Startup Arena’ and ‘Echelon Satellite.’
To encourage entrepreneurship and disruptive innovation in the Asia-Pacific, Intel and Siemens have teamed up to organize the ‘APEC Challenge’ (as a part of a two day forum) where 30 startup teams will compete for a spot in the top six, ‘Demo Day’ style. The winners will then go on to compete at the Intel Global Challenge and Global Siemens Venture Forum in Silicon Valley. Read more details on the forum here.
The APEC Challenge is extending an invite to Hong Kong startups to sign up for the competition, which will run from August 6th-7th in Taipei. Who will represent for Hong Kong this summer?
